Grab a cup of coffee for this one. Arguably, this is the most in-depth research on ASML you can find anywhere :)
The chip in the phone you’re reading this on is very likely made with machines from a single Dutch company. So is every advanced chip in the world.
This company is ASML.
ASML is the only company that can manufacture EUV lithography machines. Each of these sells for ~€230m, and without them, no AI chips can be manufactured. Even at this price, ASML’s customers can’t get machines fast enough, and the company can't meet demand through 2028.
ASML's journey is one of the best business stories, and it nearly didn’t happen.
ASML started working on EUV in 1997. 15 years later, despite the best efforts of some of the smartest engineers in the world, the technology was still years behind schedule.
That year, the smartphone boom drove a sharp rise in chip demand, and ASML's largest customers decided they couldn't wait any longer. Intel, TSMC and Samsung bought 23% of ASML for €3.85bn and committed another €1.38bn to fund its research.
Think about how unusual it is - multi-billion-dollar companies don’t usually fund their suppliers' research. They shop around for alternatives. But Intel, TSMC and Samsung all knew there was no alternative to ASML.
Even with funding and technology support from some of the world's most advanced tech companies, the first EUV-made chips didn’t ship until 2019. It took nearly 20 years and ~$9bn in R&D before EUV chips went into production.

But that persistence paid off. Today, the most advanced chips in the world, including the ones that run AI models, are printed on ASML’s EUV machines. No other company has brought one to market.
To put the demand in context, ASML is booked out till 2028, and customers are asking for allocations in 2029 and 2030!
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Here is a quick order in which we will analyze the business:
How an EUV machine works
What ASML sells
ASML’s moat and Chinese competition
Demand drivers
Why forecasts keep coming in low
Valuation and intrinsic value
Key risks
What we will track
Our take and rating
Let’s dig in.
How an EUV machine works
An EUV machine has close to 100,000 parts. The system is so large that it ships in 3 cargo planes. This huge machine prints patterns too small to see.

ASML EUV Machine
The finest patterns or lines on circuits today are ~13nm wide. The latest high-NA EUV machines can even print patterns ~8nm wide. For comparison, a human hair is ~80,000 nm in width!
One thing to note is that the industry’s node names don’t describe actual feature sizes. Nothing on TSMC’s 2nm node is 2nm wide. Transistor gates sit 48nm apart and the closest wires 26nm apart. The names are generation labels, and every chipmaker uses them that way.
Lithography enables these small patterns on silicon. The key is that the smaller a circuit is, the more of them you can print on a wafer. This directly influences a chip's computing power and memory capacity.
Nvidia’s Blackwell AI chip, made on an older TSMC process, already holds 208bn transistors across 2 dies.
How it works: A lithography machine works like a projector. Light is sent through a stencil (using this analogy to keep it simple) of the chip’s design, called the mask. The light then hits a silicon wafer coated with a light-sensitive material. Patterns are created in the wafer due to the material reacting with the light. This process is then repeated multiple times layer by layer (up to ~100 times). Also, each layer must line up with the one below within a few nanometers.
To draw smaller patterns, you need shorter-wavelength light. The older DUV technology used light with a wavelength of ~193 nanometers. EUV machines use light with a wavelength of just ~13.5 nanometers. This is what makes EUV so hard.
There is no lamp or laser that gives off EUV light. So the machine has to generate its own. To do this, the machine uses molten tin. The machine melts Tin, then lasers (Trumpf is a specialized supplier for these lasers) hit 50,000 tin droplets a second, each about a third the width of a human hair. This superheats the tin droplets to temperatures many times higher than the Sun's surface. This creates a tin cloud/gas that emits EUV light. Of course, now you have to deal with the molten tin and clean it away.
The next challenge is that almost everything absorbs EUV light, including air and glass. So the light travels through a vacuum, and the machine can't use lenses. Instead, it uses mirrors made by Zeiss. Each mirror has more than 100 layers, each only a few nanometers thick, and is smoother than an atom's width. If one mirror were the size of Germany, its biggest bump would be ~0.1 mm high.
The mirrors are able to reflect a maximum of ~70% of the light. On top of that, light reflects off of upto 11 mirrors before reaching the wafer resulting in only ~2% of the light reaching the destination. This requires a powerful light source to compensate for the intensity loss.

Then there is motion. The wafer must keep moving so the correct patterns are drawn. Since this printing happens at the atomic level, the wafer sits on a stage that starts and stops within a fraction of a second, and lands within a few nanometers of where it should be every time. Sensors check the wafer’s position up to 20,000 times a second. Any misplacement, even at the atomic level, is caught.
This is only a glimpse of the complexity. EUV stacks one extremely difficult process on top of another, making it hard to compete. The capital intensity of the R&D process, and the effort required to create another Lithography competitor, makes it very likely that no other company in the Western world will compete with ASML in the future. Only China may eventually build its own EUV, but those machines will be locked out of the Western world.
We see no threat to ASML’s monopoly.
ASML’s key product segments
ASML sells 2 kinds of lithography machines:
Extreme ultraviolet (EUV) and
Deep ultraviolet (DUV)
EUV systems: Only ASML sells these systems. The chips they print run AI systems. The standard EUV machine (called low-NA) sells for ~€230m. The latest machine, called the High-NA, can print even finer patterns. It costs ~€350m and weighs ~165 tons!
EUV system sales are estimated to account for a high-30s % of ASML’s 2026 sales.
DUV systems: These older machines print most of the layers on every chip, including AI chips, and all of the chips in cars, appliances and most electronics.
The most advanced DUV machines pass light through a thin layer of water to print sharper patterns, and ASML sells ~90% of them. Together with wafer-measuring and inspection tools, DUV sales are estimated to account for ~35% of 2026 sales.
Installed Base Management: This is ASML’s service business. This section generates revenue from maintenance, upgrades, spare parts, and other customer services. One key element here is the upgrades business. Upgrades let customers get more out of a machine they already own (for example, improving an EUV machine's efficiency). In today’s environment, where new machines are booked out for years, customers pay for upgrades as they would for new capacity.
This business is expected to grow 50% in 2026 and reach >25% of sales.
In 2025, China accounted for ~33% of ASML’s sales, and that share is expected to fall to ~20% in 2026.

ASML’s moat & Chinese Competition
We think ASML probably would be on any top 5 list of companies with the widest moat in the equity world.
The R&D moat: As we discussed before, the R&D for EUV took ~17 years and ~$ 9B. ASML’s own customers had to help with the technology. ASML spent ~€5B on R&D in 2025 (~14% of sales), and Zeiss (ASML has a ~25% stake) alone holds more than 2,000 patents on High-NA optics. A rival would need to match decades of this spending before it sold a single machine. Getting skilled R&D researchers to work on this is not easy.
Physics moat: Printing wafers at the nanometer level is not easy. EUV machines function at the edge of what’s possible. The light is made from using molten tin heated to temperatures up to ~40x the Sun’s temperature. The wafer stage starts and stops thousands of times an hour, landing within nanometers each time. ASML, Zeiss, and Trumpf have spent decades perfecting these individually difficult actions and then bringing them together in a working machine. This is not easy to achieve. Not in theory (know-how) or in the practical act of building such a machine. China’s prototype is EUV-capable but has not yet printed a working chip.
The supply chain: ASML has an extremely complicated supply chain with >5,000 suppliers and close to 100,000 parts. Zeiss designs the machine's complex optics, and it has mastered this over decades, building its processes with ASML in mind. Similarly, Trumpf’s lasers and Cymer’s (owned by ASML) light source are built around ASML’s machines. Any rival would have to build this from scratch.
Customer processes are designed around ASML machines: ASML’s customers, TSMC, Samsung, SK Hynix, Micron, and Intel, are racing to add capacity to manufacture silicon for the AI industry. Amid this rush, they have designed their current factories around ASML’s machines. Substituting the lithography machine in their manufacturing setup, when billions of dollars are on the line is an unacceptable risk. Even a competent competitor will need years and years of trials before anyone buys their machines. No chipmaker wants to focus on such non-core activities while AI demand is at a record high.
Installed Base: Every machine ASML ships joins a fleet it services and upgrades for its lifetime. ASML gets real-world performance data, which lets it keep improving the machines. No rival will get any real-world data.
How quickly can China build its own EUV machine?
This is a key risk many investors cite. Many see this as the biggest threat to ASML’s monopoly. We will not brush aside these concerns, but from what we can see, China is some way away from building a comparable EUV machine.
Even if China develops something comparable, the Western world won't use it. China will use it domestically to meet its own EUV demand, and as of today, no EUV machines are sold in China because of export bans.
The real risk is how fast China can stop buying DUV machines from ASML. Or how many years will it take for ASML’s China revenue to go to zero? In our base case, this happens in the next 5-10 years. ASML's revenue gains from the AI revolution will overshadow this loss.
Currently, China does have a state-owned company, Shanghai Aishengna, making DUV machines for the 28nm node. This is where ASML was about 15 years ago. Chinese commentators themselves say it lags ASML by about four generations. Reports say ~5 of these machines will ship this year and ~20 in 2027. ASML will ship ~130 immersion machines in 2026 alone. China’s machines still depend on imported parts, too.
An unverified 2025 story claims a Chinese firm reportedly took apart an older ASML DUV machine to reverse engineer it. They tried to break it apart and reverse-engineer its features but couldn't put it back together, so they had to call ASML’s engineers. The story is unconfirmed (it comes from a single US commentator), but it is a fun reminder of how hard these machines are to copy.
Demand drivers
The biggest risk to any AI investment today is timing. We are in the third year of the AI supercycle, and the question is whether it is nearing its end. Capex digestion could stall spending, or even cause it to fall, over the next few years. The bear cases are well known, from low returns on investment to outright capex overspending.
Here is what we see in the overall AI trade. The world’s largest and best-run firms say demand is voracious, and they are betting hundreds of billions of dollars on it. Use cases are proliferating (Meta’s Muse has found product-market fit for consumer agents), and open-source models are so good that companies can unlock significant productivity while spending far less than they did with frontier models. This bodes very well for AI infrastructure. The frontier labs may be in trouble. But that’s good for overall AI adoption.
Having seen how well AI is doing in math, investment research, coding, and many other fields, we at RC are willing to bet we are in the middle of the AI revolution.
Now we will present the demand signals for ASML’s business. All signs point to strong revenue and profit growth in the coming years:
Capacity is sold out through 2027 and 2028: ASML will sell out all the units it estimates it can produce in 2027-2028 and cannot supply full demand. This also gives it tremendous pricing power.
ASML is increasing capacity by 30% in 2027 and 30%+ in 2028: management said that even with a 30% increase in both years, supply will still not meet demand. They may increase the capacity by more than 30% in 2028. Such strong words from a generally conservative management team show how strong the demand cycle is.
Customers interested in capacity for 2029 and 2030 today: customers want to lock in capacity early.
Memory supercycle and incoming capacity additions: ASML expects its memory system sales to rise by 75% in 2026. AI memory chips need high-bandwidth memory (HBM), whose manufacturing requires more EUV lithography. The latest HBM chips actually use more EUV than previous generations.
TSMC capex and revenue guide: Although TSMC did not guide to next year’s capex in their recent earnings call, its guidance is for AI accelerator revenue to grow at a mid to high 50s % CAGR from 2024 to 2029. The CEO said: ‘Whether it is a high 50 CAGR, it does not matter. It probably will be higher.’ We have built our bottom-up estimate for WFE capex using this update.
ASML’s sales follow what its customers spend on new fabs. So we built our own estimate of what its 5 biggest customers will earn and spend out to 2030.
Here is what we expect ASML’s 5 biggest customers to earn and spend ($B):

TSMC: Its capex jumps from $41bn in 2025 to $60-64bn this year, and brokers expect $81-90bn in 2027. TSMC says its spending over 2026-28 will be significantly higher than in the past 3 years. We expect ~$115bn by 2030. That would be ~30% of its revenue, down from ~35% this year, because TSMC’s CFO expects revenue to grow faster than capex.
Memory: Memory prices have risen sharply, and SK hynix’s revenue should more than triple this year. Samsung, SK hynix and Micron spent ~$70bn on capex in 2025, and we expect ~$164bn in 2027. We assume memory prices fall back in 2028, but capex keeps growing because much of today’s spending goes into buildings. Micron says its construction spending is growing much faster than its tool spending. The machines for the new fabs (Yongin in Korea, and Micron’s fabs in Idaho and Japan) go in during 2028-29.
Intel: After cutting capex to $18bn in 2025, it plans to spend more than $20bn this year and “significantly” more in 2027 as it prepares its 14A process for 2028.
We have ignored other potentially major spending sources, like SpaceX’s terafab and other large investments to secure sovereign AI manufacturing across the Western world.
Is the valuation attractive after a ~2x upmove since Jun’25?
ASML’s shares are up ~2x since our June 2025 report. Yet the stock trades at ~25x next year’s earnings today, below the ~28x it traded at back when we first wrote about it.
Earnings estimates rose faster than the share price. This is what we like most about owning a business like ASML. The value it creates can outrun even a big stock move.

Next, we dig into why the market is giving us this opportunity and why we think the market’s forecasts are too low. Then we present our Excel model and ASML’s intrinsic value estimates.
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